Advanced packaging solutions for Photonics, RF and microelectronics


Advanced packaging solutions of RF and photonics components for applications in 5G and 6G, aerospace and defence and security is needed to achieve low power loss, efficient signal isolation and reliable functionality. Use of low-temperature cofired ceramics (LTCC) packaging substrates is one of the best options for this thanks to its superior electrical properties. With LTCC packaging it is possible to create miniaturised communications and sensor modules operating at very high frequencies, as well as photonics modules with low loss optical interfaces, high speed electronics and better thermal management.

Key facts about advanced packaging solutions for Photonics, RF and microelectronics

Packaging prototypes

We develop and supply packaging prototypes that can readily be transferred to industrial volume production.

Our offering

LTCC carriers, circuits and modules with optical, electrical and RF functionality are a core part of our advanced packaging offering.

For different industries

Our solutions benefit different industries, incl. telecom & wireless, automotive, sensor & opto-packaging, medical, and military & space

Antti Kemppainen
Antti Kemppainen
Solution Sales Lead, Sensing Solutions